MICROCIRCUIT LABORATORIES LLC

Capabilities

MicroCircuit Laboratories provides customized development services for component level, low temperature hermetic package encapsulation. Process deliverables exceed space level requirements, lowest stress to all feedthroughs and are warranted for 0 gross leakers with lowest fine leak rates. MCL’s capabilities include materials design software; class 10 cleanroom with 100% SIMCO air ionization; pre-seal moisture removal processing; headspace development with clean inert gases, including 0.1µ filtration, 0.1 PPM H2O and O2; parallel seam sealing, one shot welding; automatic gross and fine leak testing; cover seal joint inspection by optical, SEM, BSE and X-Ray methods; PIND testing. Complete tooling packages are provided so the entire process is seamless transported to manufacturing. MCL provides onsite prototyping and pilot production services with complete data provided from the network.