ARCNANO, INC.

Capabilities

Science and Engineering Physics Modeling, CAD Design, Finite Element Analysis, SBIR Partnering, STTR Partnering, Government Contracting, Sub-Contracting for Mil/Aero Primes Wafer Fab Products and Services Wafer Scale Fabrication: MEMs, Sensors, Devices Thin Film Deposition: Sputtering, Evaporation, CVD, ALD, Plating Patterning: Mask Design, GDS2 Format, Suss Front Side Back Side Mask Aligner, Canon Stepper, Heidelberg Direct Write Etching: Wet Etch, Ion Milling, RIE, DRIE, Ion Milling Wafer to Package Back End: BEOL, Chip Stacking; 2.5D, 3D Devices, Flip Chip, Laser Die Attach to Heat Sink, Photonic and Opto-Electronic Devices Wafer Back End Bare Die: Wafer Thinning, Dicing, Pick Out to Tape or Chip Tray Ultra High Precision Machining Services CNC 3 Axis and 5 Axis Milling, Wire EDM, Micro EDM, Grinding, Lapping, CMP Typical materials include hard steels, ceramics, titanium, molybdenum, Tungsten, Tantalum, and more Analytical Services SEM, EDS, XRF, FIB, AFM, MFM, TEM