KUPROS, INC.

Capabilities

Kupros, Inc. is a U.S.-owned, service-disabled veteran-led advanced manufacturing company developing Cu29, an all-metal conductive filament for standard FDM/FFF 3D printers. Cu29 enables circuits, antennas, sensors, EMI shielding, grounding paths, RF structures, and power traces to be printed directly into polymer and structural parts without sintering, plating, curing, chemical baths, or post-processing. Kupros supports government laboratories, defense primes, aerospace programs, universities, and advanced manufacturing organizations with conductive materials, test coupons, prototype articles, embedded-electronics development, CubeSat and UAS-relevant components, radiation and EMI shielding concepts, and additive manufacturing process support. Cu29 has been delivered to or evaluated by organizations including NASA, Boeing, Northrop Grumman, U.S. Army DEVCOM, KBR, ARL, JHAPL, LANL, Virginia Tech, and Youngstown State University.