MEI MICRO, INC.

Capabilities

MEI Micro has developed a MEMS inertial sensor fabrication platform (3D System, or 3DS) to produce the highest accuracy, lowest CSWaP (cost, size, weight, power) chip-scale, tactical and navigation grade Inertial Measurement Units (IMU) and Inertial Navigation Systems (INSs). These semiconductor devices, developed using MEMs (Micro Electro Mechanical Systems, or MEMs) technology, include multi-axis inertial sensors consisting of gyros, accelerometers, pressure sensors and time of flight (ToF) sensors. These devices are also paired with exact position data sensors such as GNSS, GPS, LEO, and M-Code paired in order to provide an integrated navigation system. The company uses artificial intelligence and machine learning to optimize the performance of its sensor systems and the sensor fusion (software) enabling its performance.