JET PROCESS CORP

Capabilities

Jet Process Corp. offers thin film coating services using the versatile Jet Vapor Deposition™ (JVD™) evaporation process for solders and other advanced metal coatings. We specialize in the deposition of lead free solders, including eutectic and off-eutectic gold-tin (AuSn), the tin-silver-copper (SAC) family, and other lead free alloys. Up to 4 different metal layers can be deposited in a single run, including adhesion and diffusion barrier schemes, such as Ti/Pt, solder alloys, and oxidation preventing Au caps. Low temperature and low vacuum operating conditions are compatible with most photoresist patterned wafers, heat sensitive substrates, and mask materials. JVD​'s clean, environmentally sound ​p​rocess offers many advantages over ​conventional metalizing technique​s, and has demonstrated its versatility in a wide variety of contract R&D and production work.