SIERRA ASSEMBLY TECHNOLOGY LLC

Capabilities

Printed Circuit Board (PCB) Assembly • Surface Mount Technology (SMT): Two advanced SMT lines with high-speed, precise component placement. • Through-Hole Technology (THT): Automated and manual precision placement lines. • Mixed Technology: Seamless integration of SMT, Through-Hole, and complex multi-layered setups. • Component Capabilities: Expert handling of Passives (down to 0201), Fine Pitch (to 8 Mils), BGA/VFBGA, FPGA, DFN, and leadless chip carriers. Comprehensive Manufacturing & Testing Services • Full Turnkey & Consignment: End-to-end supply chain management or assembly of customer-supplied kitted parts. • Box Build & Electromechanical Assembly: Complete enclosure assembly, systems integration, and final product packaging. • Cable & Wire Harness Assembly: Custom wire processing, lead forming, and rugged wire harness systems. • Rigid-Flex & Advanced Substrates: Assembly experience with Rigid, Flexible, Rigid-Flex, HDI, Ceramic, High-Tg, and Rogers PCBs.