HESSE MECHATRONICS, INC

Capabilities

Hesse Mechatronics, Inc develops and manufactures ultrasonic wire bonders for all wire dimensions as well as ultrasonic flipchip bonders in combination with standardized or customized automation solutions.The core competencies of the company are mechatronic systems, ultrasonic technology, control engineering and the detailed understanding and knowledge of the processes and physical effects relevant in ultrasonic joining technology. In order to maintain and expand technological leadership, we conduct intensive research and development in all aforementioned areas. For additional information and products go to hesse-mechatronics.com/