Process development for APSM sets of overlay wafers

IC production relies on measurements of the 3D size, shape, and placement of structures with atomic-level precision and repeatability. As the IRDS identified, SEM overlay measurements are already problematic due to complex 3D structures, material variety, and low signal intensities. This project will create a sound scientific foundation and comprehensive solutions for overlay and any SEM dimensional metrology superior to currently used arbitrary methods. This will allow the design of overlay patterns, acquisition, and image analysis to be optimized entirely through artificial intelligence, physics-based simulation, and modeling and meet IRDS requirements now and in the future.

Estimated value

$250K - $499K

Contract type

Unknown

• NAICS334413
• PSC334413