Market and Packaging Technology Trends

The Contractor shall deliver a corporate license to allow for an annual subscription for ten (10) subscribers that shall contain the latest developments in packaging technologies, particularly those related to Ball Grid arrays(BGAs), Chip Scale Packages (CSPs), Stacked Die CSPs, Flip Chip, Wafer Level Packages, substrates, chiplets, Co-design/EDA, equipment and processes. It shall include customer support, FOB Destination delivery, installation, warranty and training, and option line items.

Estimated value

$150K - $249K

Contract type

Unknown

• NAICS519290
• PSC519290