HT In-situ Indenter

Some of the manufacturing difficulties encountered by the heterogeneous integration of modular chips in system-in-package are due to thermal management and mechanical incompatibilities among the various interfaces and building blocks of the package. This project will provide indentation and scanning probe-based measurements for the process-induced alterations of the thermo-mechanical properties of materials and structures used in advanced packages. Building on our decades-long expertise in nanoscale to microscale mechanical property measurements on microelectronic materials, we will improve and deliver measurement methodologies and data to industry to enhance their predictive manufacturing.

Estimated value

$250K - $499K

Contract type

Unknown

• NAICS334413
• PSC334413