Custom Wafer Services

Mechanical strain impacts the performance of semiconductor devices. Manufacturing processes must be carefully controlled for strain to achieve high yielding and high-performance products. However, measuring strain in nanoscale devices remains a metrology challenge for manufacturers. Different techniques (EBSD, TKD, 4-D STEM, Raman, µXRD, etc.) are either commercially available or under development to address this need, with NIST making significant contributions to these methods. As geometric complexity and importance of strain continues to increase, we intend to continue advancing these techniques, improving their accuracy, and supply new reference materials to ensure capabilities for future-generation devices.

Estimated value

$250K - $499K

Contract type

Unknown

• NAICS334413
• PSC334413