CHIPS R&D: EUV Photoresists, Soft X-ray Reflectivity Hardware Package, Soft X-ray Reflectivity Hardware Package

Abstract The semiconductor industry continues to push for smaller features, more integration, and increased yield. New photoresist chemistries and advances in extreme ultraviolet lithography are enabling this trend. However, this is inhibited by a lack of measurements describing heterogeneities in chemistry that contribute to the quality of photoresist patterns at these smaller dimensions. This includes fundamental questions into how the EUV exposure changes the resist chemistry and its spatial extent, and the underlying mechanisms that produce those changes. Our proposed NIST team will characterize the properties of advanced lithographic materials, measure nanoscale chemical distributions, and study the patterning process in situ. This will be accomplished by further developing a suite of metrology techniques which have tailored sensitivity to both the chemistry and structure of the photoresists and how the exposure processes influ

Estimated value

$500K - $999K

Contract type

Unknown

• NAICS334413
• PSC334413