APXPS spectrometer with differential pumping system and detector

Advanced in situ and operando methods for real time monitoring of the chemical status of wafer surfaces, thin films, and interfaces during plasma processing are essential for semiconductor process development and control. We will build upon NIST's leading expertise in plasma-surface interaction, plasma diagnostics, and operando photoelectron spectromicroscopy to develop a new plasma-XPS metrology platform for quantitative sub-monolayer sensitive in-situ chemical analysis of wafer surfaces during plasma processing. This innovative metrology will be a valuable addition to the next node semiconductor process development and inspection toolset and, in a broader scope, to the fundamental measurement science of plasma-surface interaction. We will collaborate with industrial partners (see letters of support) and academia in the development, implementation, and dissemination of plasma-XPS metrology. The data generated during this project and th

Estimated value

$500K - $999K

Contract type

Unknown

• NAICS334413
• PSC334413