3D DIC System One pair of cameras, Lighting, Software

The Infrastructure and Materials Group requires the acquisition of a High-Performance 3D DIC System with integrated environmental chambers to perform non-contact optical measurements of semiconductor packages. This acquisition is directly aligned with the CHIPS R&D Metrology Program’s mission to advance measurement science for the semiconductor ecosystem, specifically supporting Grand Challenge 3 by enabling the characterization of advanced packaging integration and providing new open-source reliability tools. By providing the semiconductor industry with accurate warpage and strain data for sensitive, highly critical components like polymeric advanced packaging (e.g. underfills, redistribution layers, and thermal interface materials), this investment will significantly improve reliability design efficiency and reduce development time and costs for US manufacturers.This equipment is critical to achieving the project's mission of deve

Estimated value

$250K - $499K

Contract type

Unknown

• NAICS334413
• PSC334413