F-16 Circuit Card Assembly 3-Year IDIQ

This is a Pre-Solicitation Notice for an upcoming Solicitation for: Circuit Card Assembly to support the F-16 Aircraft. See the attachments attached to learn more about this opportunity. To gain access to the Technical Data Package (TDP) and supporting documents, the individual requesting access in SAM.gov must be on the DD2345, or be showing in the Joint Certification Program (JCP) as such. Any individual not listed will have their request rejected. Please refer to the MQR provided in the attachments Section C: e, h, i. "The award will not be delayed to provide the vendor with an opportunity to demonstrate its ability to meet the standards specified in this qualification requirement." "The offeror must be fully qualified in order to be eligible for a contract award"

• NAICS334412
• PSC5998

• SOW packages.pdf

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• 201126351_98747_2D Drawing_-.pdf

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• 20156882_98747_Test Procedure_-.pdf

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• 23002_1R8H0_2D Drawing_-.pdf

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• CDRL Counterfit Prevention Plan.pdf

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• 3573195_EI_AF462.pdf

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• EDL_REPORT.pdf

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• TRNSPDATA_REPORT.pdf

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• MQR.pdf

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• 201126351_98747_Bill of Materials_1.1_-_1.pdf

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• ITMDESC_REPORT.pdf

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• Pre-Sol Notice 5711 FA821226Q0004.pdf

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• 20156881_98747_Test Procedure_-.pdf

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• PKGRQMT_REPORT.pdf

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• 23002_1R8H0_Bill of Materials_-.pdf

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• EDL -5711WF.pdf

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• 23000_1R8H0_2D Drawing_-.pdf

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• Brandon Moses
  brandon.moses.1@us.af.mil8015861055
• Avery Irwin
  avery.irwin@us.af.mil8015866355