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Multichip Module Package for SiC Pressure Sensors

NATIONAL AERONAUTICS AND SPACE ADMINISTRATION · OH
Response deadline
Jun 30, 2026
Closed
Date posted
Jun 26, 2026

Description

** THIS IS A SOLE SOURCE REQUIREMENT ** for Multichip Module Package for SiC Pressure Sensors

Classifications

Documents (3)

  • SATPC0041552 Tab 07 Capability Statement.pdf
    .pdf108 KB
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  • SATPC0041552 Tab 04 4 SOW..pdf
    .pdf268 KB
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  • SATPC0041552 Tab 06 RDSS..pdf
    .pdf195 KB
    Download

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