SAM.gov80NSSC26936730Q
Open
Multichip Module Package for SiC Pressure Sensors
- Response deadline
- Jun 30, 2026 Closed
- Date posted
- Jun 26, 2026
- Source
- Open notice
Description
** THIS IS A SOLE SOURCE REQUIREMENT ** for Multichip Module Package for SiC Pressure Sensors
Classifications
Documents (3)
Contacts
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