AdvM Benchtop Fused Disposition Modeling (FDM) Printers

AMENDMENDT 01 This amendment to the Call for Solutions includes the following key changes: Title Change: The title of this Call for Solutions has been changed from "Advanced Manufacturing for Expeditionary Additive Manufacturing (EAM) Systems" to "Advanced Manufacturing for Benchtop Fused Disposition Modeling (FDM) Printers." Revised Requirement: Several requirement attributes, including the suspense date for Solution Briefs, have been updated. All changes within the amended Call for Solutions are highlighted in yellow for easy identification. All future submissions must be based on the requirements outlined in the amended document. ------------------------------------------------------------------------------------------------------- The U.S. Army Aviation and Missile Command (AMCOM) is seeking innovative solutions consisting of three (3) Expeditionary Additive Manufacturing (EAM) Systems for immediate integration at Fort Campbell, Fort Hood, and Fort Bragg. These systems will provide an expeditionary, point-of-need manufacturing capability designed to immediately translate digital technical data packages (TDPs) into structural, environmentally-grade components within tactical maintenance environments. Establishing expeditionary, point-of-need manufacturing capability at these installations is vital for empowering forward-deployed liaison engineers to manufacture immediate, structurally adequate replacement parts, fixtures, and specialized maintenance tooling on-site. Proactively deploying this capability is essential for overcoming extended supply chain lead times for low-demand, non-flight-safety-essential components, mitigating critical aviation readiness degradation, and significantly reducing prolonged aircraft-on-ground (AOG) status for simple component failures. The full Call for Solutions document(.pdf), detailing the problem statement, required solution attributes, submission requirements, and evaluation phases, is available in the "Attachments" section below. All questions regarding this Call must be submitted via email to Melissa Jakes at melissa.d.jakes.civ@army.mil and Morgan McGee at morgan.p.mcgee2.civ@army.mil. The deadline to submit questions for Phase 1 is Wednesday, 26 August 2026, at 12:00 PM Central Time. The following shall be utilized in the email subject line: " Call for Solution – Advanced Manufacturing Expeditionary Additive Manufacturing (EAM) Systems’ This Call for Solution is issued under the Army Advanced Manufacturing (AdvM) Commercial Solutions Opening (CSO) which can be found at: https://sam.gov/opp/e2f1410155dc4ba78c51fca8360875cf/review

• NAICS333248
• PSC3695

• Amendment 01_Call for Solutions PANRSA-26-P-0000 040885.pdf

  .pdf313 KBNot yet available

• Melissa Jakes
  usarmy.redstone.acc.mbx.acc-rsa-advm-cso@army.mil