Civic AI
Procurement intelligence
Federal contract award
ATOMIC FUSION WAFER BONDING TOOL FOR ULTRA-HIGH POWER SWITCHES.
PARTOW TECHNOLOGIES LLC · Department of Defense
- Value
- $1,699,828
- Start
- Mar 1, 2024
- End
- May 31, 2026
- Action date
- Jan 20, 2026
- PIID
- W911NF24C0041
- Status
- completed
- NAICS
- 541715 · RESEARCH AND DEVELOPMENT IN THE PHYSICAL, ENGINEERING, AND LIFE SCIENCES (EXCEPT NANOTECHNOLOGY AND BIOTECHNOLOGY)
- Place of performance
- VISTA, CA
- Award type
- DEFINITIVE CONTRACT
Description
ATOMIC FUSION WAFER BONDING TOOL FOR ULTRA-HIGH POWER SWITCHES.
Need modifications, related awards, and vendor peers? Open the full award workspace.