SAM.govW52P1J26R0001
Open
Secure Packaged Microelectronic Components, Printed Circuit Boards, and Supporting Technologies
- Response deadline
- Sep 16, 2026 Closed
- Date posted
- Aug 17, 2026
- Source
- Open notice
Description
Refer to the Attachment, R2.0_SS_RFI_SUBMISSION_v1.2.
Classifications
Documents (1)
- R2.0_SS_RFI_SUBMISSION_v1.2.pdf.pdf210 KBNot yet available
Contacts
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